DIP Mounting

Pacific Microelectronics accepts various PCB assembling orders. One of the main advantages of our company is individual approach to each project and the use of modern equipment for performing various mounting operations.

We use the automated DIP component mounting machines, which prevent incidental mounting of wrong components or components with improper polarity. Besides that, in the DIP mounting process the component terminals are preformed which prevents components from falling out in the process of wave soldering and follow-up assembling of items into packages.

Our production facilities are capable of mounting any DIP components in lead packages, axial-lead and radial-lead components as well as nonstandard and large-size components and connectors.

Pacific Microelectronics performs multi-stage quality control at all phases of electronic module assembling process. In such situation, we can offer you optimum production schedule and prices and ensure 100% quality of the manufactured products.