Number of Layers

Single layer printed circuit boards

Double layer printed circuit boards

Multi-layer printed circuit boards (4-28 layers)

  Materials

FR-2, FR-4, CEM-1, FR-4 High TG, PI, PTFE, PPO, Rogers, Taconic and etc.

Conductor Width

minimum 0.1mm

Track distance

minimum 0.1mm

Distance between Components pads

minimum 0.2mm

Via Diameter

minimum 0.1mm

Standard Copper Foil Thickness

18mm

35mm

Covering

15~20mm HAL hot-dip tinning

Immersion Ni-Au plating, thickness: 5mm (Ni) + 0.1mm (Au)

Galvanic Ni-Au plating, thickness: 5mm (Ni) + 1mm (Au)

Immersion tin

Carbon paste

Gold fingers

Solder mask

Liquid photoimageable solder mask of any colors (green, blue, red, yellow, black, etc.)

Mask-pad gap

0.1mm

Silk screen printing color

Any color (white, yellow, black, etc.)

Silk screen printing line thickness

minimum 0.1mm

PCB contour processing

milling

scribing

stamp

Contour processing precision 

- 0.1mm

Possible FR4 material thickness

0.3mm
0.5mm
0.8mm
1.0mm - standard
1.5mm - standard
1.6mm - standard
2.0mm

Maximum dimensions of PCB panels

Single-layer and double-layer PCB – 550mm x 550mm

Multi-layer PCB - 460mm x 508mm

Quality Control

Adapter e-test

Flying probe e-test

Automatic optical inspection (A.O.I.)

Accepted File Format

PCAD 4.5, PCAD 8; ACCEL EDA, PCAD 200X, PROTEL, ORCAD, EAGLE, DEP7, CAM350, CAMTASTIC, Gerber files

Additional Production Capabilities

·      Manufacturing of PCBs with blind and buried vias

·      Manufacturing of PCBs on metal base

·      Manufacturing of PCBs using high-temperature high-frequency materials

·      Manufacturing of flexible PCBs